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Leader in Integrated ICT Hardware & Systems

Marc Rensing - Packaging Engineer

Marc Rensing

Contact

+353 (0)21 2346631
marc.rensing (at) tyndall (dot) ie

  • Photonics
  • B1.41B-19

Marc Rensing  received his BSc (Hons) degree in Physics from the University of Hull in 2001 and his M.Eng from DCU in 2006 where he worked on the Generation and Optimisation of Picosecond Optical Pulses for use in Broadband Communications Systems. From 2006 to 2008 he was a Device Test Engineer with Eblana Photonics before joining the Integrated Photonics Packaging group in October 2008. He is responsible for the development of advanced photonic packaging solutions such as Flip Chip, Wire Bonding and Die Attach process.